Forecast On Quad Flat No-Leads Packaging Market Global Industry Analysis and Trends till 2026

Trends in the Quad Flat No-Leads Packaging Market
2016-2026
April 2017
Report Id : REP-GB-2039
Status : Ongoing
Category : Industrial Automation and Equipment
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Quad Flat No-Leads Packaging Market
Chip scale packaging is one of the packaging types for integrated circuits. Quad flat No Leads (QFN) is a
one such chip scale packages with lead frame substrate. The quad flat no- leads which is plastic
encapsulated package is a surface mount technology where IC’s are attached to the surfaces of printed
circuit boards. Quad flat no-leads electrically connect the integrated circuits to printed circuit boards
(PCB). The QFN are available in configurations such as saw singulated and punch formats. High
performance (thermal and electrical), compacted size and lower costs are some of the important
differentiating features than the conventional lead frame type of packages. QFN is widely used in RF
applications, Bluetooth In 2015, global printed circuit board market was US$ 58.5 Bn, and it is expected
to growth due to high demand. Thus, boosting global quad flat no-leads packaging market.
The QFN market is primarily driven by the high demand in printed circuit board and flexible printed circuit
board. Availability of QFN with various sizes boosts the global QFN market. Besides, the trend of smaller
circuit designs in the electronic industry, increase in smartphone production and other handheld devices
fuel the global QFN market. Other factors which aid in driving the global QFN market are its greater
surface mount area, lower cost, light in weight.
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Quad Flat No-Leads Packaging Market
However, the specifications and guidelines for QFN manufacturing such as Japan Electronics and
Information Technology Industries Association (JEITA), Joint Electron Device Engineering Council (JEDEC)
and others are tight hence the global QFN market scenario limited with established players.
The global quad flat no-leads market is segmented on the basis type of QFN and application.
Based on type of QFN, global quad flat no-leads market is segmented into:
 Thin quad flat no-lead package (TQFN)
 Dual flat no-lead package (DFN)
Based on application, global quad flat no-leads market is segmented into:
 RF
 Power management
 Multi-chip modules
 Wearable’s
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Quad Flat No-Leads Packaging Market
 Internet of Things (loT), Bluetooth devices & Automotive.
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Geographically the global quad flat no-leads market is divided into five key regions including North
America, Latin America, Europe, Asia-Pacific (APAC) and the Middle East & Africa (MEA).North America
holds the major share in the quad flat no-leads market due to increasing in sales of flexible circuits.
Followed by North America is Asia Pacific, especially China, holds a maximum share of Quad Flat Noleadsmarket. The quadflat no-leads marketin Europe, Latin America, and MEA are comparatively less
robust than APAC market since the presence of the majority of electronic manufacturing sites in Asian
countries.
Quad Flat No-leads Packaging Market - Major Players:
The some of the key players identified in the global Quad Flat No-leads Packaging market are Amkor
Technology, Lumileds Holding B.V., ASE Group, Henkel Corporation, Broadcom Limited, China Wafer
Level CSP Co., Ltd, etc.
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