Quad Flat No-Leads Packaging Market Volume Forecast and Value Chain Analysis 2016-2026

Quad Flat NoLeads Packaging
Market
Share, Global Trends,
Analysis, Research, Report,
Opportunities,
Segmentation and Forecast,
2016– 2026
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Report
Description
Report Description
Chip scale packaging is one of the packaging types for integrated circuits. Quad flat No Leads
(QFN) is a one such chip scale packages with lead frame substrate. The quad flat no- leads which
is plastic encapsulated package is a surface mount technology where IC’s are attached to the
surfaces of printed circuit boards. Quad flat no-leads electrically connect the integrated circuits
to printed circuit boards (PCB). The QFN are available in configurations such as saw singulated
and punch formats. High performance (thermal and electrical), compacted size and lower costs
are some of the important differentiating features than the conventional lead frame type of
packages. QFN is widely used in RF applications, Bluetooth In 2015, global printed circuit board
market was US$ 58.5 Bn, and it is expected to growth due to high demand. Thus, boosting global
quad flat no-leads packaging market.
The QFN market is primarily driven by the high demand in printed circuit board and flexible
printed circuit board. Availability of QFN with various sizes boosts the global QFN market.
Besides, the trend of smaller circuit designs in the electronic industry, increase in smartphone
production and other handheld devices fuel the global QFN market. Other factors which aid in
driving the global QFN market are its greater surface mount area, lower cost, light in weight.
However, the specifications and guidelines for QFN manufacturing such as Japan Electronics and
Information Technology Industries Association (JEITA), Joint Electron Device Engineering Council
(JEDEC) and others are tight hence the global QFN market scenario limited with established
players.
Report
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The global quad flat no-leads market is segmented on the basis type of QFN and application.
Based on type of QFN, global quad flat no-leads market is segmented into:
Thin quad flat no-lead package (TQFN)
Dual flat no-lead package (DFN)
Based on application, global quad flat no-leads market is segmented into:
RF
Power management
Multi-chip modules
Wearable’s
Internet of Things (loT)
Bluetooth devices
Automotive
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Report
Description
Report Description
Geographically the global quad flat no-leads market is divided into five key regions including
North America, Latin America, Europe, Asia-Pacific (APAC) and the Middle East & Africa
(MEA).North America holds the major share in the quad flat no-leads market due to increasing
in sales of flexible circuits. Followed by North America is Asia Pacific, especially China, holds a
maximum share of Quad Flat No-leadsmarket. The quadflat no-leads marketin Europe, Latin
America, and MEA are comparatively less robust than APAC market since the presence of the
majority of electronic manufacturing sites in Asian countries.
Quad Flat No-leads Packaging Market - Major Players:
The some of the key players identified in the global Quad Flat No-leads Packaging market are
Amkor Technology, Lumileds Holding B.V., ASE Group, Henkel Corporation, Broadcom Limited,
China Wafer Level CSP Co., Ltd, etc.
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