Wi-Fi

Simplifying Wireless
Confidence of Certification
Integrating LSR wireless modules that are precertified with multiple antennas saves significant
certification time and costs for your design project.
(Typically $30-$50K in savings)
5.8 GHz
2.4 GHz
Bluetooth Stack
Bluetooth
®
Bluetooth SIG Qualified
System-on-Chip
Embedded Wireless Modules
Selection Guide
Unmatched Levels of Support
LSR’s US-based technical team is committed to a
great customer experience, providing best-inindustry tech support as well as full Design Review
services.
Silica
www.silica.com
EBV Elektronik
www.ebv.com
Telsys (Israel Only)
www.telsys.co.il
Avnet Australia
em.avnetasia.com
Farnell
www.farnell.com
Avnet Electronics Marketing
www.avnetexpress.com
Mouser Electronics
www.mouser.com
Important Notice: The products and services of LS Research described herein are sold subject to LS Research standard terms and conditions of sale. Customers are advised to
obtain the most current and complete information about LSR products and services before placing orders. LS Research assumes no liability for applications assistance, customer’s
applications or product designs, software performance, or infringement of patents. The publication of information regarding any other company’s products or services does not
constitute LS Research’s approval, warranty or endorsement thereof.
IEEE 802.15.4
Zigbee
Arrow Electronics Europe
www.arroweurope.com
Digi-Key
www.digikey.com
Cloud Connectivity
LSR
Design. Create. Certify. Connect.
FLEXConnect™
6LowPan
Internet of Things
Proprietary Protocols
Mesh Networks
Arrow Electronics
parts.arrow.com
®
LSR Authorized Distributors
FCC/IC/CE Certification
900 MHz
Bluetooth Smart
Learn more at www.lsr.com and follow us on LinkedIn and Twitter (@LSResearch).
TiWiConnect™
System-on-Chip
BLE 4.0
Our experienced professionals are passionate and committed to partnering with you, allowing
your team to focus on the most important element of product development: the unique needs of
your customers.
Small Footprint
802.11 a/b/g/n
Wireless
LSR’s wireless modules provide a straightforward means for integrating wireless technologies such as Wi-Fi, Bluetooth®, Bluetooth® Smart,
and 802.15.4 protocols into either new or legacy
product designs.
Since 1980, our partners, spanning a wide range of industries, have trusted LSR to help develop
solutions that exceed their customers’ expectations. We provide an unmatched suite of wireless product design services, EMC Testing & Certification, and performance RF products, all to
improve speed to market and return on your development investment.
Wi-Fi
2.4 GHz
Bringing a winning product to market in today’s competitive environment requires greater skill,
creativity and experience than ever before. More and more, your customers demand intuitive,
reliable wireless capabilities that give them the real-time information and controls to be more
connected.
TCP/IP Stack
Inspiring through Wireless InnovationsSM
Development Kits
WLAN
About LSR
www.lsr.com | 262.375.4400
LSR Certified Wireless Modules
ProFLEX and SiFLEX modules not shown to scale
TiWi-BLE™
TiWi5™
TiWi-C-W™
TiWi-SL™
TiWi-uB1™
TiWi-uB2™
Description
Wi-Fi with Bluetooth
2.1+ EDR, BLE 4.0
and ANT+
Wi-Fi with Bluetooth
2.1+ EDR, BLE 4.0
and ANT+
Stand-alone 802.11
b/g/n Wi-Fi module
with ARM Cortex-M3
apps processor
Wi-Fi SPI interface
with embedded
firmware, drivers, and
TCP/IP stack
Built in CC2541
single-chip BLE 4.0
System-on-Chip (SoC)
Bluetooth 2.1+ EDR,
and BLE 4.0 module
Frequency
Band
2.4 GHz
2.4 & 5.8 GHz
2.4 GHz
2.4 GHz
2.4 GHz
2.4 GHz
Microprocessor to
run WLAN
TCP/IP stack
Microprocessor to
run WLAN
TCP/IP stack
Development
Architecture:
Integration
directly into M3
processor, or simple
integration over UART
interface to external
microcontrollers or
microprocessors
Microcontroller or
microprocessor with
a serial port (SPI) + 6
KB Flash, 3KB RAM
Integrated 8051
microcontroller or
network processor
interface for
applications running
on an external
microcontroller
SDIO (WLAN), UART,
and Advanced
Audio Interface
(Bluetooth®)
SDIO (WLAN), UART,
and Advanced
Audio Interface
(Bluetooth®)
UART
SPI
13 mm x 18 mm x
1.9 mm
13 mm x 18 mm x
1.9 mm
10.5 mm x 10.5 mm x
1.35 mm
•
•
•
•
• off-module SMT
antenna
• Dipole via U.FL
Host
Processor
Requirements
Hardware
Interfaces
Size
Antenna
off-module chip
Dipole via U.FL
PIFA via U.FL
Flexible Dipole via
U. FL
•
•
•
•
off-module chip
Dipole
Waterproof Dipole
FlexPIFA™
14 mm x 21 mm x
2.8 mm
• off-module chip
• Dipole via U.FL
ProFLEX01-SOC™
SiFLEX02-R2™
SiFLEX02-R2-HP™
Description
High performance
802.15.4
radios and
microcontrollers
High performance
802.15.4 radio based
on TI CC2530 SoC
High performance
802.15.4
radios and
microcontrollers
High performance
802.15.4
radios and
microcontrollers
Frequency
Band
2.4 GHz
2.4 GHz
<1 GHz
<1 GHz
100
100
250
750
Receive
Sensitivity
-98 dBm
-97 dBm
-102 dBm
<-104 dBm
Processor
MSP430
MSP430
ATxMega256A3U
ATxMega256A3U
Radio
CC2520
CC2530
AT86RF212B
AT86RF212B
22.8 mm x
41.4 mm
22.8 mm x
41.4 mm
22.8 mm x
41.4 mm
22.8 mm x
41.4 mm
Output Power
Microcontroller or
microprocessor with
a serial port (UART)
UART, SPI, Digital I/O,
and Analog Inputs
HCI, UART, and Audio
PCM interfaces
11.6 mm x 17.9 mm x
2.3 mm
7 mm x 7 mm x
1.5 mm
• Hybrid trace
antenna
• Dipole via U.FL
ProFLEX01-R2™
• off-module chip
• Dipole via U.FL
Certifications
Size
Antenna
• Inverted F
• Dipole via U.FL
• Inverted F
• Dipole via U.FL
•
•
•
•
RF castellation
Wire
Dipole via U.FL
Helical
• RF castellation
• Dipole via U.FL
Certifications
pending for TiWi-C-W™
Wi-Fi + Bluetooth®
Bluetooth®
Wi-Fi
802.15.4
Module accessories available at LSR.com:
TiWi-C-W features a cloud agent for the
™
Module | Cloud | App
cloud-connectivity platform
Antennas
Gateways &
Cables
Dev Kits
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